XC17S150APD8C
vs
XC17S150APDG8I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
DIP
DIP
Package Description
PLASTIC, DIP-8
DIP,
Pin Count
8
8
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.51
I/O Type
COMMON
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e0
e3
Length
9.3599 mm
9.3599 mm
Memory Density
1040096 bit
1040096 bit
Memory IC Type
CONFIGURATION MEMORY
CONFIGURATION MEMORY
Memory Width
1
1
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
1040096 words
1040096 words
Number of Words Code
1040096
1040096
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1040096X1
1040096X1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
225
250
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.5974 mm
4.5974 mm
Standby Current-Max
0.00005 A
0.00005 A
Supply Current-Max
0.01 mA
0.01 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
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