XC17S10XLVO8I vs XC17S10VOG8C feature comparison

XC17S10XLVO8I AMD Xilinx

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XC17S10VOG8C AMD Xilinx

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code TSOP TSOP
Package Description PLASTIC, TSOP-8 TSOP2, DIP8,.3
Pin Count 8 8
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e0 e3
Length 4.9 mm 4.9 mm
Memory Density 95752 bit 95008 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 95752 words 95008 words
Number of Words Code 95752 95008
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 95752X1 95008X1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 TSOP2
Package Equivalence Code TSSOP8,.25,20 TSSOP8,.25,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 225 260
Programming Voltage 3.3 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.00005 A 0.00005 A
Supply Current-Max 0.005 mA 0.01 mA
Supply Voltage-Max (Vsup) 3.6 V 5.25 V
Supply Voltage-Min (Vsup) 3 V 4.75 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD Matte Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 3.9 mm 3.9 mm
Base Number Matches 1 1