XC17S10XLVO8C
vs
XC17S10XLPDG8C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
TSOP
DIP
Package Description
PLASTIC, TSOP-8
ROHS COMPLIANT, PLASTIC, DIP-8
Pin Count
8
8
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
JESD-609 Code
e0
e3
Length
4.9 mm
9.3599 mm
Memory Density
95752 bit
95752 bit
Memory IC Type
CONFIGURATION MEMORY
CONFIGURATION MEMORY
Memory Width
1
1
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
95752 words
95752 words
Number of Words Code
95752
95752
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
95752X1
95752X1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
DIP
Package Equivalence Code
TSSOP8,.25,20
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
225
250
Programming Voltage
3.3 V
3.3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
4.5974 mm
Standby Current-Max
0.00005 A
0.00005 A
Supply Current-Max
0.005 mA
0.005 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Matte Tin (Sn)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
3.9 mm
7.62 mm
Base Number Matches
1
1