XC17S10PDG8I
vs
XC17S10VO8I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
DIP
TSOP
Package Description
DIP,
PLASTIC, TSOP-8
Pin Count
8
8
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
JESD-609 Code
e3
e0
Length
9.3599 mm
4.9 mm
Memory Density
95008 bit
95008 bit
Memory IC Type
CONFIGURATION MEMORY
CONFIGURATION MEMORY
Memory Width
1
1
Moisture Sensitivity Level
1
3
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
95008 words
95008 words
Number of Words Code
95008
95008
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
95008X1
95008X1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
TSOP2
Package Equivalence Code
DIP8,.3
TSSOP8,.25,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
250
225
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.5974 mm
1.2 mm
Standby Current-Max
0.00005 A
0.00005 A
Supply Current-Max
0.01 mA
0.01 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
TIN LEAD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
7.62 mm
3.9 mm
Base Number Matches
1
1
Compare XC17S10PDG8I with alternatives