XC17S10PDG8C vs XC17S10PD8C feature comparison

XC17S10PDG8C AMD Xilinx

Buy Now Datasheet

XC17S10PD8C AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code DIP DIP
Package Description DIP, PLASTIC, DIP-8
Pin Count 8 8
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e3 e0
Length 9.3599 mm 9.3599 mm
Memory Density 95008 bit 95008 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 1 1
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 95008 words 95008 words
Number of Words Code 95008 95008
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 95008X1 95008X1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 250 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.5974 mm 4.5974 mm
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 10 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code DIP8,.3
Standby Current-Max 0.00005 A
Supply Current-Max 0.01 mA

Compare XC17S10PDG8C with alternatives

Compare XC17S10PD8C with alternatives