XC17S10PD8C vs XC17S10XLPD8C feature comparison

XC17S10PD8C Rochester Electronics LLC

Buy Now Datasheet

XC17S10XLPD8C AMD Xilinx

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC XILINX INC
Part Package Code DIP DIP
Package Description DIP, PLASTIC, DIP-8
Pin Count 8 8
Reach Compliance Code unknown not_compliant
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0 e0
Length 9.3599 mm 9.3599 mm
Memory Density 95008 bit 95752 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 95008 words 95752 words
Number of Words Code 95008 95752
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 95008X1 95752X1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 4.5974 mm 4.5974 mm
Supply Voltage-Max (Vsup) 5.25 V 3.6 V
Supply Voltage-Min (Vsup) 4.75 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
Rohs Code No
ECCN Code EAR99
HTS Code 8542.32.00.71
Clock Frequency-Max (fCLK) 10 MHz
I/O Type COMMON
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Package Equivalence Code DIP8,.3
Peak Reflow Temperature (Cel) 225
Standby Current-Max 0.00005 A
Supply Current-Max 0.005 mA
Time@Peak Reflow Temperature-Max (s) 30

Compare XC17S10XLPD8C with alternatives