XC17S05XLPDG8C
vs
XC17S10PD8C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
XILINX INC
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
8
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e3
e0
Length
9.3599 mm
9.3599 mm
Memory Density
54544 bit
95008 bit
Memory IC Type
CONFIGURATION MEMORY
MEMORY CIRCUIT
Memory Width
1
1
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
54544 words
95008 words
Number of Words Code
54544
95008
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
54544X1
95008X1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
Peak Reflow Temperature (Cel)
250
Programming Voltage
3.3 V
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
4.5974 mm
4.5974 mm
Standby Current-Max
0.00005 A
Supply Current-Max
0.005 mA
Supply Voltage-Max (Vsup)
3.6 V
5.25 V
Supply Voltage-Min (Vsup)
3 V
4.75 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
7.62 mm
7.62 mm
Base Number Matches
1
2
Compare XC17S05XLPDG8C with alternatives