XC1765LSO8I vs XC1765L-SO8C feature comparison

XC1765LSO8I AMD Xilinx

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XC1765L-SO8C AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code SOIC SOIC
Package Description PLASTIC, SOIC-8 SOP, SOP8,.25
Pin Count 8 8
Reach Compliance Code not_compliant compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 2.5 MHz 2.5 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e0 e0
Length 4.9 mm 4.9 mm
Memory Density 65536 bit 65536 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 64KX1 64KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP8,.25 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Standby Current-Max 0.0015 A 0.0005 A
Supply Current-Max 0.005 mA 0.005 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn85Pb15)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Power Supplies 3.3 V

Compare XC1765LSO8I with alternatives

Compare XC1765L-SO8C with alternatives