XC1765LPC20C vs XC1765ELPC20C feature comparison

XC1765LPC20C AMD Xilinx

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XC1765ELPC20C Rochester Electronics LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer XILINX INC ROCHESTER ELECTRONICS LLC
Part Package Code QLCC QLCC
Package Description PLASTIC, LCC-20 PLASTIC, LCC-20
Pin Count 20 20
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 2.5 MHz
I/O Type COMMON
JESD-30 Code S-PQCC-J20 S-PQCC-J20
JESD-609 Code e0 e0
Length 8.9662 mm 8.9662 mm
Memory Density 65536 bit 65536 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX1 64KX1
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC20,.4SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 4.572 mm 4.572 mm
Standby Current-Max 0.0015 A
Supply Current-Max 0.005 mA
Supply Voltage-Max (Vsup) 5.25 V 3.6 V
Supply Voltage-Min (Vsup) 4.75 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 8.9662 mm 8.9662 mm
Base Number Matches 1 2
Pbfree Code No
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

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