XC1765ELPCG20C
vs
MPA17128FNC
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
MOTOROLA INC
|
| Part Package Code |
QLCC
|
QLCC
|
| Package Description |
QCCJ,
|
QCCJ,
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.71
|
| Additional Feature |
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
|
|
| JESD-30 Code |
S-PQCC-J20
|
S-PQCC-J20
|
| JESD-609 Code |
e3
|
|
| Length |
8.9662 mm
|
8.9662 mm
|
| Memory Density |
65536 bit
|
131072 bit
|
| Memory IC Type |
CONFIGURATION MEMORY
|
OTP ROM
|
| Memory Width |
1
|
1
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Number of Words |
65536 words
|
131072 words
|
| Number of Words Code |
64000
|
128000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
64KX1
|
128KX1
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.572 mm
|
4.57 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
8.9662 mm
|
8.9662 mm
|
| Base Number Matches |
1
|
1
|
| Output Characteristics |
|
3-STATE
|
|
|
|
Compare XC1765ELPCG20C with alternatives
Compare MPA17128FNC with alternatives