XC1765DSO8C vs XC17256ELVOG8C feature comparison

XC1765DSO8C AMD Xilinx

Buy Now Datasheet

XC17256ELVOG8C AMD Xilinx

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code SOIC TSOP
Package Description PLASTIC, SOIC-8 TSOP2,
Pin Count 8 8
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 5 MHz
I/O Type COMMON
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e0 e3
Length 4.9 mm 4.9276 mm
Memory Density 65536 bit 262144 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 65536 words 262144 words
Number of Words Code 64000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX1 256KX1
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP2
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 225 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.1938 mm
Standby Current-Max 0.0015 A
Supply Current-Max 0.01 mA
Supply Voltage-Max (Vsup) 5.25 V 3.6 V
Supply Voltage-Min (Vsup) 4.75 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 3.9 mm 3.937 mm
Base Number Matches 1 1
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

Compare XC1765DSO8C with alternatives

Compare XC17256ELVOG8C with alternatives