XC1765-DD8R
vs
XC1765EPD8I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
DIP
DIP
Package Description
DIP,
PLASTIC, DIP-8
Pin Count
8
8
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
JESD-30 Code
R-GDIP-T8
R-PDIP-T8
Length
9.906 mm
9.3599 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
CONFIGURATION MEMORY
CONFIGURATION MEMORY
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
64KX1
64KX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
4.5974 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
2
Rohs Code
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Clock Frequency-Max (fCLK)
10 MHz
I/O Type
COMMON
JESD-609 Code
e0
Moisture Sensitivity Level
1
Package Equivalence Code
DIP8,.3
Peak Reflow Temperature (Cel)
225
Standby Current-Max
0.00005 A
Supply Current-Max
0.01 mA
Terminal Finish
Tin/Lead (Sn85Pb15)
Time@Peak Reflow Temperature-Max (s)
30
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Compare XC1765EPD8I with alternatives