XC17256LVO8C
vs
XC1765ELSO8I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
TSOP
SOIC
Package Description
PLASTIC, TSOP-8
PLASTIC, SOP-8
Pin Count
8
8
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
10 MHz
2.5 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e0
e0
Length
4.9276 mm
4.9276 mm
Memory Density
262144 bit
65536 bit
Memory IC Type
CONFIGURATION MEMORY
CONFIGURATION MEMORY
Memory Width
1
1
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
262144 words
65536 words
Number of Words Code
256000
64000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
256KX1
64KX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
SOP
Package Equivalence Code
TSOP8,.25
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
225
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1938 mm
1.7272 mm
Standby Current-Max
0.00005 A
0.00005 A
Supply Current-Max
0.005 mA
0.005 mA
Supply Voltage-Max (Vsup)
5.25 V
3.6 V
Supply Voltage-Min (Vsup)
4.75 V
3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
3.937 mm
3.937 mm
Base Number Matches
1
1
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Compare XC17256LVO8C with alternatives
Compare XC1765ELSO8I with alternatives