XC17256EPD8I
vs
M25P40-VMC6TG/4A
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
MICRON TECHNOLOGY INC
Part Package Code
DIP
Package Description
PLASTIC, DIP-8
4 X 3 MM, ROHS COMPLIANT, UFDFP-8
Pin Count
8
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Clock Frequency-Max (fCLK)
15 MHz
75 MHz
I/O Type
COMMON
JESD-30 Code
R-PDIP-T8
R-PDSO-N8
JESD-609 Code
e0
Length
9.3599 mm
4 mm
Memory Density
262144 bit
4194304 bit
Memory IC Type
CONFIGURATION MEMORY
FLASH
Memory Width
1
8
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
262144 words
524288 words
Number of Words Code
256000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX1
512KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
HVSON
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Seated Height-Max
4.5974 mm
0.6 mm
Standby Current-Max
0.00005 A
Supply Current-Max
0.01 mA
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
2.7 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
0.8 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
7.62 mm
3 mm
Base Number Matches
1
1
Programming Voltage
2.7 V
Type
NOR TYPE
Compare XC17256EPD8I with alternatives
Compare M25P40-VMC6TG/4A with alternatives