XC17256DPD8I vs XC17256DDD8B feature comparison

XC17256DPD8I AMD Xilinx

Buy Now Datasheet

XC17256DDD8B AMD Xilinx

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code DIP DIP
Package Description PLASTIC, DIP-8 DIP, DIP8,.3
Pin Count 8 8
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 12 MHz 12 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T8 R-GDIP-T8
JESD-609 Code e0 e0
Length 9.3599 mm 10.16 mm
Memory Density 262144 bit 262144 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 256KX1 256KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.5974 mm 5.08 mm
Standby Current-Max 0.00005 A 0.00005 A
Supply Current-Max 0.01 mA 0.01 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
Pbfree Code No
Screening Level MIL-STD-883 Class B

Compare XC17256DPD8I with alternatives

Compare XC17256DDD8B with alternatives