XC17256D-DDG8B
vs
XC17256DPD8I
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP,
|
PLASTIC, DIP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A001.A.2.C
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Additional Feature |
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
|
|
| JESD-30 Code |
R-GDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
9.906 mm
|
9.3599 mm
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
CONFIGURATION MEMORY
|
CONFIGURATION MEMORY
|
| Memory Width |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Organization |
256KX1
|
256KX1
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.318 mm
|
4.5974 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| Clock Frequency-Max (fCLK) |
|
12 MHz
|
| I/O Type |
|
COMMON
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
DIP8,.3
|
| Peak Reflow Temperature (Cel) |
|
225
|
| Standby Current-Max |
|
0.00005 A
|
| Supply Current-Max |
|
0.01 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare XC17256D-DDG8B with alternatives
Compare XC17256DPD8I with alternatives