XC17256D-DDG8B
vs
M45PE10-VMP6
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
MICRON TECHNOLOGY INC
Part Package Code
DIP
DFP
Package Description
DIP,
6 X 5 MM, PLASTIC, VDFPN-8
Pin Count
8
8
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 Code
R-GDIP-T8
R-XDSO-N8
JESD-609 Code
e3
Length
9.906 mm
6 mm
Memory Density
262144 bit
1048576 bit
Memory IC Type
CONFIGURATION MEMORY
FLASH
Memory Width
1
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
262144 words
131072 words
Number of Words Code
256000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
256KX1
128KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
UNSPECIFIED
Package Code
DIP
HVSON
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.318 mm
1 mm
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
2.7 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
5 mm
Base Number Matches
1
6
Clock Frequency-Max (fCLK)
33 MHz
Peak Reflow Temperature (Cel)
235
Programming Voltage
2.7 V
Time@Peak Reflow Temperature-Max (s)
30
Type
NOR TYPE
Compare XC17256D-DDG8B with alternatives
Compare M45PE10-VMP6 with alternatives