XC17256D-DDG8B
vs
M25P32-VME3TP/4A
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
NUMONYX
|
| Part Package Code |
DIP
|
DFP
|
| Package Description |
DIP,
|
HVSON,
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Additional Feature |
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
|
|
| JESD-30 Code |
R-GDIP-T8
|
R-XDSO-N8
|
| JESD-609 Code |
e3
|
|
| Length |
9.906 mm
|
8 mm
|
| Memory Density |
262144 bit
|
33554432 bit
|
| Memory IC Type |
CONFIGURATION MEMORY
|
FLASH
|
| Memory Width |
1
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
262144 words
|
4194304 words
|
| Number of Words Code |
256000
|
4000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Organization |
256KX1
|
4MX8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
UNSPECIFIED
|
| Package Code |
DIP
|
HVSON
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.318 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
6 mm
|
| Base Number Matches |
1
|
1
|
| Clock Frequency-Max (fCLK) |
|
75 MHz
|
| Programming Voltage |
|
2.7 V
|
|
|
|
Compare XC17256D-DDG8B with alternatives
Compare M25P32-VME3TP/4A with alternatives