XC17256D-DD8R vs XC17256DPD8C feature comparison

XC17256D-DD8R AMD Xilinx

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XC17256DPD8C AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.51
Access Time-Max 200 ns
Clock Frequency-Max (fCLK) 12 MHz 12 MHz
I/O Type COMMON COMMON
JESD-30 Code R-XDIP-T8 R-PDIP-T8
Memory Density 2097152 bit 262144 bit
Memory IC Type OTP ROM CONFIGURATION MEMORY
Memory Width 8 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 256KX8 256KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL SERIAL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.00005 A 0.00005 A
Supply Current-Max 0.01 mA 0.01 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code DIP
Package Description PLASTIC, DIP-8
Pin Count 8
JESD-609 Code e0
Length 9.3599 mm
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 225
Seated Height-Max 4.5974 mm
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm

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