XC17256D-DD8I
vs
5962-9561701MPA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Package Description
DIP, DIP8,.3
DIP, DIP8,.3
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.71
8542.32.00.51
Access Time-Max
150 ns
Clock Frequency-Max (fCLK)
12 MHz
12.5 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-XDIP-T8
R-GDIP-T8
Memory Density
1048576 bit
262144 bit
Memory IC Type
OTP ROM
CONFIGURATION MEMORY
Memory Width
16
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
262144 words
262144 words
Number of Words Code
64000
256000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
64KX16
256KX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.00005 A
0.00005 A
Supply Current-Max
0.01 mA
0.01 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Part Package Code
DIP
Pin Count
8
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-609 Code
e0
Length
10.16 mm
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
Terminal Finish
TIN LEAD
Width
7.62 mm
Compare XC17256D-DD8I with alternatives
Compare 5962-9561701MPA with alternatives