XC1718D-PD8C
vs
XC1718DPD8C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
DIP
DIP
Package Description
PLASTIC, DIP-8
PLASTIC, DIP-8
Pin Count
8
8
Reach Compliance Code
compliant
not_compliant
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Clock Frequency-Max (fCLK)
5 MHz
5 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e0
e0
Length
9.3599 mm
9.3599 mm
Memory Density
18144 bit
18144 bit
Memory IC Type
CONFIGURATION MEMORY
CONFIGURATION MEMORY
Memory Width
1
1
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
18144 words
18144 words
Number of Words Code
18144
18144
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
18144X1
18144X1
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Power Supplies
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.5974 mm
4.5974 mm
Standby Current-Max
0.0015 A
0.0015 A
Supply Current-Max
0.01 mA
0.01 mA
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
2
ECCN Code
EAR99
HTS Code
8542.32.00.51
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
30
Compare XC1718D-PD8C with alternatives
Compare XC1718DPD8C with alternatives