XC17128ELVO8I vs XC17256LVO8I feature comparison

XC17128ELVO8I Rochester Electronics LLC

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XC17256LVO8I AMD Xilinx

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC XILINX INC
Part Package Code TSOP TSOP
Package Description PLASTIC, TSOP-8 PLASTIC, TSOP-8
Pin Count 8 8
Reach Compliance Code unknown not_compliant
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e0 e0
Length 4.9276 mm 4.9276 mm
Memory Density 131072 bit 262144 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 131072 words 262144 words
Number of Words Code 128000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX1 256KX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 TSOP2
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 225 225
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 1.1938 mm 1.1938 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 3.937 mm 3.937 mm
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 10 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code TSOP8,.25
Standby Current-Max 0.00005 A
Supply Current-Max 0.005 mA

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