XC17128DDD8M vs XC17128D-DDG8M feature comparison

XC17128DDD8M AMD Xilinx

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XC17128D-DDG8M AMD Xilinx

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code DIP DIP
Package Description CERAMIC, DIP-8 DIP,
Pin Count 8 8
Reach Compliance Code unknown unknown
Clock Frequency-Max (fCLK) 12.5 MHz
I/O Type COMMON
JESD-30 Code R-GDIP-T8 R-GDIP-T8
JESD-609 Code e0
Length 10.16 mm 9.906 mm
Memory Density 131072 bit 131072 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX1 128KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.318 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.01 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

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Compare XC17128D-DDG8M with alternatives