XC17128D-DDG8M vs S25FL008A0LMAC001 feature comparison

XC17128D-DDG8M AMD Xilinx

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S25FL008A0LMAC001 Spansion

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC SPANSION INC
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP8,.3
Pin Count 8 8
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 Code R-GDIP-T8 S-PDSO-G8
Length 9.906 mm 5.283 mm
Memory Density 131072 bit 8388608 bit
Memory IC Type CONFIGURATION MEMORY FLASH
Memory Width 1 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 131072 words 1048576 words
Number of Words Code 128000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 128KX1 1MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.318 mm 2.159 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 5.283 mm
Base Number Matches 1 3
Clock Frequency-Max (fCLK) 50 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-609 Code e0
Package Equivalence Code SOP8,.3
Programming Voltage 3 V
Serial Bus Type SPI
Standby Current-Max 0.00001 A
Supply Current-Max 0.024 mA
Terminal Finish TIN LEAD
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE

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