XC1701-PCG20C
vs
XC17512LPC20I
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
XILINX INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QLCC
|
QLCC
|
| Package Description |
PLASTIC, LCC-20
|
QCCJ,
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
compliant
|
unknown
|
| Access Time-Max |
45 ns
|
|
| JESD-30 Code |
S-PQCC-J20
|
S-PQCC-J20
|
| JESD-609 Code |
e3
|
e0
|
| Length |
8.9662 mm
|
8.9662 mm
|
| Memory Density |
1048576 bit
|
524288 bit
|
| Memory IC Type |
CONFIGURATION MEMORY
|
CONFIGURATION MEMORY
|
| Memory Width |
1
|
1
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Number of Words |
1048576 words
|
524288 words
|
| Number of Words Code |
1000000
|
512000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
1MX1
|
512KX1
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
260
|
225
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
4.57 mm
|
4.572 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
8.9662 mm
|
8.9662 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Additional Feature |
|
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
|
|
|
|
Compare XC1701-PCG20C with alternatives