XA6SLX25-3FGG484I
vs
XC6SLX25-3FG484C
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
XILINX INC
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| Clock Frequency-Max |
62.5 MHz
|
862 MHz
|
| JESD-30 Code |
S-PBGA-B484
|
S-PBGA-B484
|
| JESD-609 Code |
e1
|
e0
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Inputs |
266
|
266
|
| Number of Logic Cells |
24051
|
24051
|
| Number of Outputs |
266
|
266
|
| Number of Terminals |
484
|
484
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA484,22X22,40
|
BGA484,22X22,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
250
|
225
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
AEC-Q100
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
BGA
|
| Package Description |
|
23 X 23 MM, 1 MM PITCH, FBGA-484
|
| Pin Count |
|
484
|
| ECCN Code |
|
3A991.D
|
| HTS Code |
|
8542.39.00.01
|
| Combinatorial Delay of a CLB-Max |
|
0.21 ns
|
| Length |
|
23 mm
|
| Number of CLBs |
|
1879
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
1879 CLBS
|
| Seated Height-Max |
|
2.6 mm
|
| Supply Voltage-Max |
|
1.26 V
|
| Supply Voltage-Min |
|
1.14 V
|
| Supply Voltage-Nom |
|
1.2 V
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
OTHER
|
| Width |
|
23 mm
|
|
|
|
Compare XC6SLX25-3FG484C with alternatives