XA6SLX25-3FGG484I
vs
XA6SLX25-2FG484I
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
XILINX INC
|
Reach Compliance Code |
compliant
|
not_compliant
|
Clock Frequency-Max |
62.5 MHz
|
667 MHz
|
JESD-30 Code |
S-PBGA-B484
|
S-PBGA-B484
|
JESD-609 Code |
e1
|
e0
|
Moisture Sensitivity Level |
3
|
3
|
Number of Inputs |
266
|
266
|
Number of Logic Cells |
24051
|
24051
|
Number of Outputs |
266
|
266
|
Number of Terminals |
484
|
484
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA484,22X22,40
|
BGA484,22X22,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
250
|
225
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
AEC-Q100
|
AEC-Q100
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
2
|
2
|
HTS Code |
|
8542.39.00.01
|
Technology |
|
CMOS
|
|
|
|
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