XA6SLX25-3CSG324I
vs
XC6SLX25-3CSG324C
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
62.5 MHz
|
862 MHz
|
JESD-30 Code |
S-PBGA-B324
|
S-PBGA-B324
|
JESD-609 Code |
e1
|
e1
|
Moisture Sensitivity Level |
3
|
3
|
Number of Inputs |
226
|
226
|
Number of Logic Cells |
24051
|
24051
|
Number of Outputs |
226
|
226
|
Number of Terminals |
324
|
324
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FBGA
|
LFBGA
|
Package Equivalence Code |
BGA324,18X18,32
|
BGA324,18X18,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
AEC-Q100
|
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
BGA
|
Package Description |
|
15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324
|
Pin Count |
|
324
|
Combinatorial Delay of a CLB-Max |
|
0.21 ns
|
Length |
|
15 mm
|
Number of CLBs |
|
1879
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
|
1879 CLBS
|
Seated Height-Max |
|
1.5 mm
|
Supply Voltage-Max |
|
1.26 V
|
Supply Voltage-Min |
|
1.14 V
|
Supply Voltage-Nom |
|
1.2 V
|
Technology |
|
CMOS
|
Temperature Grade |
|
OTHER
|
Width |
|
15 mm
|
|
|
|
Compare XA6SLX25-3CSG324I with alternatives
Compare XC6SLX25-3CSG324C with alternatives