XA3S700A-4FGG484I vs XC3S700AN-5FGG484C feature comparison

XA3S700A-4FGG484I AMD Xilinx

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XC3S700AN-5FGG484C AMD Xilinx

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, BGA484,22X22,40 FBGA-484
Pin Count 484 484
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 667 MHz 770 MHz
Combinatorial Delay of a CLB-Max 4.88 ns 0.62 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e1
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1472 1472
Number of Equivalent Gates 700000 700000
Number of Inputs 372 372
Number of Logic Cells 13248 13248
Number of Outputs 288 288
Number of Terminals 484 484
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1472 CLBS, 700000 GATES 1472 CLBS, 700000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level AEC-Q100
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 1 2
Pbfree Code Yes
Factory Lead Time 45 Weeks

Compare XA3S700A-4FGG484I with alternatives

Compare XC3S700AN-5FGG484C with alternatives