XA3S200A-4FTG256I
vs
XC3S200AN-4FT256C
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| Clock Frequency-Max |
667 MHz
|
667 MHz
|
| Combinatorial Delay of a CLB-Max |
4.88 ns
|
0.71 ns
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e1
|
e0
|
| Length |
17 mm
|
17 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
448
|
448
|
| Number of Equivalent Gates |
200000
|
200000
|
| Number of Inputs |
195
|
195
|
| Number of Logic Cells |
4032
|
4032
|
| Number of Outputs |
160
|
160
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
100 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
448 CLBS, 200000 GATES
|
448 CLBS, 200000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.55 mm
|
1.55 mm
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
17 mm
|
17 mm
|
| Base Number Matches |
2
|
2
|
| Package Description |
|
FTBGA-256
|
| Samacsys Manufacturer |
|
AMD
|
|
|
|