XA3S1500-4FGG676I
vs
XC3S1500L-4FG676C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
XILINX INC
Package Description
LEAD FREE, FBGA-676
FBGA-676
Reach Compliance Code
compliant
not_compliant
Samacsys Manufacturer
AMD
Clock Frequency-Max
125 MHz
JESD-30 Code
S-PBGA-B676
S-PBGA-B676
JESD-609 Code
e1
e0
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of CLBs
3328
3328
Number of Equivalent Gates
1500000
1500000
Number of Inputs
487
487
Number of Logic Cells
29952
29952
Number of Outputs
487
487
Number of Terminals
676
676
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
3328 CLBS, 1500000 GATES
3328 CLBS, 1500000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA676,26X26,40
BGA676,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Screening Level
AEC-Q100
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN SILVER COPPER
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
27 mm
27 mm
Base Number Matches
2
1
Part Package Code
BGA
Pin Count
676
HTS Code
8542.39.00.01
Technology
CMOS
Compare XC3S1500L-4FG676C with alternatives