X88257ET1
vs
PYA28HC256120LM
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
XICOR INC
PYRAMID SEMICONDUCTOR CORP
Package Description
CERAMIC, LCC-32
0.450 X 0.550 INCH, CERAMIC, LCC-32
Reach Compliance Code
unknown
compliant
Access Time-Max
120 ns
120 ns
JESD-30 Code
R-CQCC-N32
R-CQCC-N32
Length
13.97 mm
13.97 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
QCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.048 mm
1.905 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.43 mm
11.43 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
QFJ
Pin Count
32
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.51
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Write Cycle Time-Max (tWC)
10 ms
Compare X88257ET1 with alternatives
Compare PYA28HC256120LM with alternatives