X88257EI vs PYA28HC256E-120LMB feature comparison

X88257EI Xicor Inc

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PYA28HC256E-120LMB Pyramid Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer XICOR INC PYRAMID SEMICONDUCTOR CORP
Package Description CERAMIC, LCC-32 0.450 X 0.550 INCH, CERAMIC, LCC-32
Reach Compliance Code unknown compliant
Access Time-Max 120 ns 120 ns
Command User Interface NO
Data Polling NO
JESD-30 Code R-CQCC-N32 R-CQCC-N32
JESD-609 Code e0 e0
Length 13.97 mm 13.97 mm
Memory Density 262144 bit 262144 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN QCCN
Package Equivalence Code LCC32,.45X.55
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Page Size 128 words
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.048 mm 1.905 mm
Standby Current-Max 0.0005 A
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Toggle Bit YES
Width 11.43 mm 11.43 mm
Base Number Matches 1 1
Pbfree Code No
Part Package Code QFJ
Pin Count 32
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Screening Level MIL-STD-883 Class B
Write Cycle Time-Max (tWC) 10 ms

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