X84640ZMG vs X25650Z-2.5 feature comparison

X84640ZMG IC Microsystems Sdn Bhd

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X25650Z-2.5 Xicor Inc

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IC MICROSYSTEMS SDN BHD XICOR INC
Part Package Code BGA
Package Description VBGA, XBGA-8
Pin Count 8
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 10 MHz 5 MHz
JESD-30 Code R-XBGA-B8 R-PBGA-B8
Length 3.912 mm 4.048 mm
Memory Density 65536 bit 65536 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 8KX8 8KX8
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code VBGA VBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.61 mm 0.675 mm
Serial Bus Type 3-WIRE SPI
Supply Current-Max 0.002 mA 0.005 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 2.5 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 1.982 mm 2.118 mm
Write Cycle Time-Max (tWC) 5 ms 10 ms
Base Number Matches 1 1
Additional Feature 1 MILLION ENDURANCE CYCLES; 100 YEARS DATA RETENTION
Data Retention Time-Min 100
Endurance 100000 Write/Erase Cycles
JESD-609 Code e0
Package Equivalence Code BGA8,2X4,48/40
Standby Current-Max 0.000001 A
Terminal Finish TIN LEAD
Write Protection HARDWARE/SOFTWARE

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