X76F200W-2 vs X76F200WIG-2 feature comparison

X76F200W-2 IC Microsystems Sdn Bhd

Buy Now Datasheet

X76F200WIG-2 IC Microsystems Sdn Bhd

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Contact Manufacturer Contact Manufacturer
Ihs Manufacturer IC MICROSYSTEMS SDN BHD IC MICROSYSTEMS SDN BHD
Part Package Code WAFER WAFER
Package Description DIE, DIE,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
JESD-30 Code X-XUUC-N X-XUUC-N
JESD-609 Code e0
Memory Density 2048 bit 2048 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256X8 256X8
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Shape UNSPECIFIED UNSPECIFIED
Package Style UNCASED CHIP UNCASED CHIP
Parallel/Serial SERIAL SERIAL
Programming Voltage 2.2 V 2.2 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Type NOR TYPE NOR TYPE
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 1 MHz
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare X76F200W-2 with alternatives

Compare X76F200WIG-2 with alternatives