X68C64PISLIC
vs
X68C64DI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XICOR INC
XICOR INC
Package Description
PLASTIC, DIP-24
HERMETIC SEALED, CERDIP-24
Reach Compliance Code
unknown
unknown
Access Time-Max
120 ns
120 ns
Additional Feature
SOFTWARE DATA PROTECTION
JESD-30 Code
R-PDIP-T24
R-GDIP-T24
Length
31.685 mm
32.07 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8KX8
8KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.87 mm
5.72 mm
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
Rohs Code
Command User Interface
NO
Data Polling
NO
JESD-609 Code
e0
Package Equivalence Code
DIP24,.6
Page Size
32 words
Standby Current-Max
0.0005 A
Supply Current-Max
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Terminal Finish
TIN LEAD
Toggle Bit
YES
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