X28VC256JM-90
vs
MEM832JMB-90
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XICOR INC
MOSAIC SEMICONDUCTOR INC
Package Description
PLASTIC, LCC-32
,
Reach Compliance Code
unknown
unknown
Access Time-Max
90 ns
90 ns
Additional Feature
PAGE WRITE
PAGE WRITE; BULK ERASE; AUTOMATIC WRITE
Command User Interface
NO
Data Polling
YES
Endurance
10000 Write/Erase Cycles
JESD-30 Code
R-PQCC-J32
R-CQCC-J32
JESD-609 Code
e0
Length
13.97 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC32,.5X.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Page Size
128 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.56 mm
Standby Current-Max
0.025 A
Supply Current-Max
0.08 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
Terminal Position
QUAD
QUAD
Toggle Bit
YES
Width
11.43 mm
Base Number Matches
1
2
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.51
Compare X28VC256JM-90 with alternatives
Compare MEM832JMB-90 with alternatives