X28HC256FMB-12T1
vs
X88257JIT1
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XICOR INC
|
XICOR INC
|
| Package Description |
DFP,
|
QCCJ,
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
120 ns
|
120 ns
|
| Additional Feature |
100000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION
|
10000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION; SOFTWARE DATA PROTECTION
|
| Data Retention Time-Min |
100
|
100
|
| Endurance |
100000 Write/Erase Cycles
|
10000 Write/Erase Cycles
|
| JESD-30 Code |
R-CDFP-F28
|
R-PQCC-J32
|
| Length |
18.288 mm
|
13.97 mm
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
32
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Organization |
32KX8
|
32KX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DFP
|
QCCJ
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.3 mm
|
3.56 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
FLAT
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Write Cycle Time-Max (tWC) |
5 ms
|
|
| Base Number Matches |
1
|
1
|
| Width |
|
11.43 mm
|
|
|
|
Compare X28HC256FMB-12T1 with alternatives
Compare X88257JIT1 with alternatives