X28HC256FI-90T1
vs
AT28HC256-90FJ
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XICOR INC
MICROCHIP TECHNOLOGY INC
Package Description
DFP,
BOTTOM BRAZED, CERAMIC, FP-28
Reach Compliance Code
unknown
compliant
Access Time-Max
90 ns
90 ns
Additional Feature
100000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION
AUTOMATIC WRITE
Data Retention Time-Min
100
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-CDFP-F28
R-CDFP-F28
Length
18.288 mm
18.3 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.3 mm
3.02 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Write Cycle Time-Max (tWC)
5 ms
Base Number Matches
1
2
Rohs Code
ECCN Code
EAR99
HTS Code
8542.32.00.51
JESD-609 Code
e3
Moisture Sensitivity Level
1
Terminal Finish
MATTE TIN
Width
10.16 mm
Compare X28HC256FI-90T1 with alternatives
Compare AT28HC256-90FJ with alternatives