X28HC256DI-15C7846 vs 5962-8852514XC feature comparison

X28HC256DI-15C7846 Intersil Corporation

Buy Now Datasheet

5962-8852514XC Microchip Technology Inc

Buy Now
Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTERSIL CORP MICROCHIP TECHNOLOGY INC
Part Package Code DIP
Package Description DIP, DIP28,.6 CERAMIC, DIP-28
Pin Count 28
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 150 ns 150 ns
Command User Interface NO
Data Polling YES
Data Retention Time-Min 100
Endurance 1000000 Write/Erase Cycles
JESD-30 Code R-GDIP-T28 R-GDIP-T28
JESD-609 Code e0 e4
Memory Density 262144 bit 262144 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Page Size 128 words
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.92 mm 4.2418 mm
Standby Current-Max 0.0005 A
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Toggle Bit YES
Width 15.24 mm 15.24 mm
Write Cycle Time-Max (tWC) 5 ms 10 ms
Base Number Matches 1 1
Length 37.215 mm
Screening Level MIL-STD-883

Compare X28HC256DI-15C7846 with alternatives

Compare 5962-8852514XC with alternatives