X28C513JI-25 vs X28C513JM-25T1 feature comparison

X28C513JI-25 Rochester Electronics LLC

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X28C513JM-25T1 Xicor Inc

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC XICOR INC
Package Description QCCJ, PLASTIC, LCC-32
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 250 ns 250 ns
JESD-30 Code R-PQCC-J32 R-PQCC-J32
Length 13.97 mm 13.97 mm
Memory Density 524288 bit 524288 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 64KX8 64KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 5 V 5 V
Seated Height-Max 3.56 mm 3.56 mm
Supply Current-Max 0.05 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11.43 mm 11.43 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 3 1
Output Characteristics 3-STATE
Qualification Status Not Qualified
Screening Level MIL-STD-883

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