X28C513EM-90 vs AM28F512-90DIB feature comparison

X28C513EM-90 Rochester Electronics LLC

Buy Now Datasheet

AM28F512-90DIB AMD

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC ADVANCED MICRO DEVICES INC
Package Description HQCCN, DIP, DIP32,.6
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 90 ns
JESD-30 Code R-CQCC-N32 R-GDIP-T32
Length 13.965 mm 42.1005 mm
Memory Density 524288 bit 524288 bit
Memory IC Type EEPROM FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 64KX8 64KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code HQCCN DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 5 V 12 V
Screening Level MIL-STD-883
Seated Height-Max 3.05 mm 5.588 mm
Supply Current-Max 0.05 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11.425 mm 15.24 mm
Write Cycle Time-Max (tWC) 10 ms
Base Number Matches 3 1
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 32
Additional Feature BULK ERASE
Command User Interface YES
Data Polling NO
Endurance 10000 Write/Erase Cycles
JESD-609 Code e0
Package Equivalence Code DIP32,.6
Qualification Status Not Qualified
Standby Current-Max 0.0001 A
Terminal Finish TIN LEAD
Toggle Bit NO
Type NOR TYPE

Compare AM28F512-90DIB with alternatives