X28C256GM-25
vs
X28C256EMB-25
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XICOR INC
XICOR INC
Package Description
FRIT SEALED, CERAMIC, LCC-32
QCCN, LCC32,.45X.55
Reach Compliance Code
unknown
unknown
Access Time-Max
250 ns
250 ns
Command User Interface
NO
NO
Data Polling
YES
YES
Endurance
10000 Write/Erase Cycles
100000 Write/Erase Cycles
JESD-30 Code
R-GQCC-N32
R-CQCC-N32
JESD-609 Code
e0
e0
Length
13.97 mm
13.97 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
QCCN
Package Equivalence Code
LCC32,.45X.55
LCC32,.45X.55
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Page Size
64 words
64 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.048 mm
3.05 mm
Standby Current-Max
0.0002 A
0.0005 A
Supply Current-Max
0.06 mA
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Toggle Bit
YES
YES
Width
11.43 mm
11.43 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Base Number Matches
1
1
Additional Feature
100000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION
Data Retention Time-Min
100
Screening Level
MIL-STD-883
Compare X28C256GM-25 with alternatives
Compare X28C256EMB-25 with alternatives