X28C256EMB-15
vs
28C256-15I/K
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XICOR INC
MICROCHIP TECHNOLOGY INC
Package Description
CERAMIC, LCC-32
CERAMIC, LCC-32
Reach Compliance Code
unknown
unknown
Access Time-Max
150 ns
150 ns
Additional Feature
PAGE WRITE
AUTOMATIC WRITE
Command User Interface
NO
NO
Data Polling
YES
YES
Endurance
10000 Write/Erase Cycles
10000 Write/Erase Cycles
JESD-30 Code
R-CQCC-N32
R-CQCC-N32
JESD-609 Code
e0
e0
Length
13.97 mm
13.97 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
32KX8
32KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
QCCN
Package Equivalence Code
LCC32,.45X.55
LCC32,.45X.55
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Page Size
64 words
64 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
3.05 mm
3.048 mm
Standby Current-Max
0.0005 A
0.00015 A
Supply Current-Max
0.06 mA
0.07 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Toggle Bit
YES
YES
Width
11.43 mm
11.43 mm
Write Cycle Time-Max (tWC)
10 ms
2 ms
Base Number Matches
1
1
Pbfree Code
Part Package Code
QFJ
Pin Count
32
ECCN Code
EAR99
HTS Code
8542.32.00.51
Output Characteristics
3-STATE
Compare X28C256EMB-15 with alternatives
Compare 28C256-15I/K with alternatives