X28C256DM-20
vs
KM28C256I-20
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XICOR INC
SAMSUNG SEMICONDUCTOR INC
Package Description
DIP, DIP28,.6
DIP, DIP28,.6
Reach Compliance Code
unknown
unknown
Access Time-Max
200 ns
200 ns
Additional Feature
100000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION
Command User Interface
NO
NO
Data Polling
YES
YES
Data Retention Time-Min
100
Endurance
100000 Write/Erase Cycles
10000 Write/Erase Cycles
JESD-30 Code
R-GDIP-T28
R-PDIP-T28
JESD-609 Code
e0
e0
Length
37.15 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Page Size
64 words
64 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.9 mm
5.59 mm
Standby Current-Max
0.0005 A
0.0001 A
Supply Current-Max
0.06 mA
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Toggle Bit
YES
YES
Width
15.24 mm
15.24 mm
Write Cycle Time-Max (tWC)
10 ms
5 ms
Base Number Matches
1
1
Pbfree Code
No
Part Package Code
DIP
Pin Count
28
ECCN Code
EAR99
HTS Code
8542.32.00.51
Compare X28C256DM-20 with alternatives
Compare KM28C256I-20 with alternatives