X28C256DI-15 vs KM28C256I-15 feature comparison

X28C256DI-15 Xicor Inc

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KM28C256I-15 Samsung Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XICOR INC SAMSUNG SEMICONDUCTOR INC
Package Description DIP, DIP28,.6 DIP, DIP28,.6
Reach Compliance Code unknown unknown
Access Time-Max 150 ns 150 ns
Additional Feature PAGE WRITE
Command User Interface NO NO
Data Polling YES YES
Data Retention Time-Min 100 10
Endurance 100000 Write/Erase Cycles 10000 Write/Erase Cycles
JESD-30 Code R-GDIP-T28 R-PDIP-T28
JESD-609 Code e0 e0
Length 37.15 mm 37.2 mm
Memory Density 262144 bit 262144 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32KX8 32KX8
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Page Size 64 words 64 words
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.9 mm 5.59 mm
Standby Current-Max 0.0005 A 0.0001 A
Supply Current-Max 0.06 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Toggle Bit YES YES
Width 15.24 mm 15.24 mm
Write Cycle Time-Max (tWC) 10 ms 5 ms
Base Number Matches 1 1
Pbfree Code No
Part Package Code DIP
Pin Count 28
ECCN Code EAR99
HTS Code 8542.32.00.51

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