X28C010NM-20T1
vs
DPV27C101G-250M
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
INTERSIL CORP
|
DPAC TECHNOLOGIES CORP
|
Part Package Code |
QFJ
|
QFJ
|
Package Description |
QCCN,
|
QCCN,
|
Pin Count |
32
|
32
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.32.00.51
|
8542.32.00.61
|
Access Time-Max |
200 ns
|
250 ns
|
JESD-30 Code |
R-CQCC-N32
|
R-CQCC-N32
|
Length |
17.78 mm
|
13.97 mm
|
Memory Density |
1048576 bit
|
1048576 bit
|
Memory IC Type |
EEPROM
|
UVPROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Number of Words |
131072 words
|
131072 words
|
Number of Words Code |
128000
|
128000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
128KX8
|
128KX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QCCN
|
QCCN
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
5 V
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.048 mm
|
3.3274 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
11.43 mm
|
11.43 mm
|
Write Cycle Time-Max (tWC) |
10 ms
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare X28C010NM-20T1 with alternatives
Compare DPV27C101G-250M with alternatives