X28C010GI-25
vs
X28C010FI-25
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XICOR INC
INTERSIL CORP
Package Description
FRIT SEALED, CERAMIC, LCC-32
DFP, FL32,.5
Reach Compliance Code
unknown
compliant
Access Time-Max
250 ns
250 ns
Command User Interface
NO
NO
Data Polling
YES
YES
JESD-30 Code
R-GQCC-N32
R-CDFP-F32
JESD-609 Code
e0
e3
Length
13.97 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
DFP
Package Equivalence Code
LCC32,.45X.55
FL32,.5
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
FLATPACK
Page Size
256 words
256 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.048 mm
3.05 mm
Standby Current-Max
0.0005 A
0.0005 A
Supply Current-Max
0.05 mA
0.05 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
NO LEAD
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
DUAL
Toggle Bit
YES
YES
Width
11.43 mm
11.049 mm
Base Number Matches
2
1
Part Package Code
DFP
Pin Count
32
ECCN Code
EAR99
HTS Code
8542.32.00.51
Additional Feature
PAGE WRITE
Write Cycle Time-Max (tWC)
10 ms
Compare X28C010GI-25 with alternatives
Compare X28C010FI-25 with alternatives