X28C010FMB-15
vs
5962-3826705MZA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
XICOR INC
MICROCHIP TECHNOLOGY INC
Package Description
CERAMIC, FP-32
Reach Compliance Code
unknown
unknown
Access Time-Max
150 ns
150 ns
Additional Feature
PAGE WRITE
Command User Interface
NO
NO
Data Polling
YES
YES
JESD-30 Code
R-CDFP-F32
R-CDFP-F32
JESD-609 Code
e0
Memory Density
1048576 bit
1048576 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
DFP
Package Equivalence Code
FL32,.5
FL32,.5
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Page Size
256 words
128 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
MIL-STD-883 Class B
Seated Height-Max
3.05 mm
3.05 mm
Standby Current-Max
0.0005 A
0.0003 A
Supply Current-Max
0.05 mA
0.08 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Toggle Bit
YES
YES
Width
11.6586 mm
12.195 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Base Number Matches
3
5
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.51
Date Of Intro
2020-03-09
Data Retention Time-Min
10
Endurance
10000 Write/Erase Cycles
Length
20.84 mm