X28C010F-25
vs
X28C010FM-25
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
XICOR INC
Package Description
DFP, FL32,.5
CERAMIC, FP-32
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
250 ns
250 ns
Command User Interface
NO
NO
Data Polling
YES
YES
JESD-30 Code
R-XDFP-F32
R-CDFP-F32
Memory Density
1048576 bit
1048576 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
128KX8
128KX8
Package Body Material
CERAMIC
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
DFP
Package Equivalence Code
FL32,.5
FL32,.5
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Page Size
256 words
256 words
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.0005 A
0.0005 A
Supply Current-Max
0.05 mA
0.05 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Toggle Bit
YES
YES
Base Number Matches
3
3
Additional Feature
PAGE WRITE
JESD-609 Code
e0
Number of Functions
1
Operating Mode
ASYNCHRONOUS
Output Characteristics
3-STATE
Programming Voltage
5 V
Seated Height-Max
3.05 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Terminal Finish
TIN LEAD
Width
11.6586 mm
Write Cycle Time-Max (tWC)
10 ms
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